Power Modules

New Generation power modules with laser welding

SlimPACK-II

Voltage 750V IGBT/1200V IGBT/SiC

Current output 350 - 520Arms

Conti. operating temp. 200°C

Stray inductance 6 nH

Cooling Pin-Fin direct water cooled

Substrate size 100 x 75.5 mm

New Generation power modules with laser welding

SlimPACK-E

Voltage 750V IGBT/1200V IGBT/SiC

Current output 480 - 620Arms

Conti. operating temp. 185°C

Stray inductance 5.4 nH

Cooling Pin-Fin direct water cooled

Substrate size 140 x 72 mm

Application scenario Compatible with both PHEV/BEV platforms

 

HB800S750Q3F2F2F2

New Generation for high power, compact dual inverter

IGBT MODULE | OreoPACK 750V/800A

Voltage/Current 750V/800A

Max junction temp. 150°C

Stray inductance 7.5 nH

Cooling Double side water cooled

Substrate size 73 x 63 mm

Reliability Standard AQG324

 

SP820R750D1F2F2D2L

Compact design for main street products

IGBT MODULE | DrivePACK 750V/820A

Voltage/Current 750V/820A

Max junction temp. 150°C

Stray inductance 8 nH

Cooling Pin-Fin direct/indirect water cooled

Substrate material High performance Cu substrate / High reliable

AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

 
SP600R650A2M1F3

SP600R650A2M1F3

Compatible design for main street products

IGBT MODULE | DrivePACK 650V/600A

Voltage/Current 650V/600A

Max junction temp. 150°C

Stray inductance 8 nH

Cooling Pin-Fin direct/indirect water cooled

Substrate material High performance Cu substrate / High reliable

AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

 
SP450R1200A2F4

SP600R1200U4F5

Design for high voltage, high power rating products

IGBT MODULE | DrivePACK 1200V/600A

Voltage/Current 1200V/600A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material High performance Cu substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

 
SP1000R750D1R400D2SiC

SP1000R750D1R400D2SiC

SiC MODULE | DrivePACK 750V/1000A

Voltage/Current 750V/1000A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material High reliable AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

 
SP1000R1200D1R400D2SiC

SP1000R1200D1R400D2SiC

SiC MODULE | DrivePACK 1200V/800A

Voltage/Current 1200V/1000A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material Cu Baseplate & Si3N4 Substrate​

Substrate size 152 x 92 mm

Reliability Standard AQG324

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  • Power Terminals Compatible with Mainstream Products

  • Direct Water-Cooled Design with PinFin

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  • Highly Reliable Ceramics and Substrate Material

  • Complies with Automotive Reliability Standards

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  • Optimized loop inductance design

  • Improved electrical module performance