New Generation for high power, compact dual inverter

IGBT MODULE | OreoPACK 750V/800A

Voltage/Current 750V/800A

Max junction temp. 150°C

Stray inductance 7.5 nH

Cooling Double side water cooled

Substrate size 73 x 63 mm

Reliability Standard AQG324

Compact design for main street products

IGBT MODULE | DrivePACK 750V/820A

Voltage/Current 750V/820A

Max junction temp. 150°C

Stray inductance 8 nH

Cooling Pin-Fin direct/indirect water cooled

Substrate material High performance Cu substrate / High reliable

AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

Compatible design for main street products

IGBT MODULE | DrivePACK 650V/600A

Voltage/Current 650V/600A

Max junction temp. 150°C

Stray inductance 8 nH

Cooling Pin-Fin direct/indirect water cooled

Substrate material High performance Cu substrate / High reliable

AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

Design for high voltage, high power rating products

IGBT MODULE | DrivePACK 1200V/450A

Voltage/Current 1200V/450A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material High performance Cu substrate

Substrate size 152 x 92 mm

Reliability Standard AQG32

SiC MODULE | DrivePACK 750V/1000A

Voltage/Current 750V/1000A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material High reliable AlSiC substrate

Substrate size 152 x 92 mm

Reliability Standard AQG324

SiC MODULE | DrivePACK 1200V/800A

Voltage/Current 1200V/1000A

Max junction temp. 175°C

Stray inductance 8 nH

Cooling Pin-Fin direct water cooled

Substrate material Cu Baseplate & Si3N4 Substrate​

Substrate size 152 x 92 mm

Reliability Standard AQG324