Power Modules
New Generation power modules with laser welding
SlimPACK-II
Voltage 750V IGBT/1200V IGBT/SiC
Current output 350 - 520Arms
Conti. operating temp. 200°C
Stray inductance 6 nH
Cooling Pin-Fin direct water cooled
Substrate size 100 x 75.5 mm
New Generation power modules with laser welding
SlimPACK-E
Voltage 750V IGBT/1200V IGBT/SiC
Current output 480 - 620Arms
Conti. operating temp. 185°C
Stray inductance 5.4 nH
Cooling Pin-Fin direct water cooled
Substrate size 140 x 72 mm
Application scenario Compatible with both PHEV/BEV platforms
HB800S750Q3F2F2F2
New Generation for high power, compact dual inverter
IGBT MODULE | OreoPACK 750V/800A
Voltage/Current 750V/800A
Max junction temp. 150°C
Stray inductance 7.5 nH
Cooling Double side water cooled
Substrate size 73 x 63 mm
Reliability Standard AQG324
SP820R750D1F2F2D2L
Compact design for main street products
IGBT MODULE | DrivePACK 750V/820A
Voltage/Current 750V/820A
Max junction temp. 150°C
Stray inductance 8 nH
Cooling Pin-Fin direct/indirect water cooled
Substrate material High performance Cu substrate / High reliable
AlSiC substrate
Substrate size 152 x 92 mm
Reliability Standard AQG324
SP600R650A2M1F3
Compatible design for main street products
IGBT MODULE | DrivePACK 650V/600A
Voltage/Current 650V/600A
Max junction temp. 150°C
Stray inductance 8 nH
Cooling Pin-Fin direct/indirect water cooled
Substrate material High performance Cu substrate / High reliable
AlSiC substrate
Substrate size 152 x 92 mm
Reliability Standard AQG324
SP600R1200U4F5
Design for high voltage, high power rating products
IGBT MODULE | DrivePACK 1200V/600A
Voltage/Current 1200V/600A
Max junction temp. 175°C
Stray inductance 8 nH
Cooling Pin-Fin direct water cooled
Substrate material High performance Cu substrate
Substrate size 152 x 92 mm
Reliability Standard AQG324
SP1000R750D1R400D2SiC
SiC MODULE | DrivePACK 750V/1000A
Voltage/Current 750V/1000A
Max junction temp. 175°C
Stray inductance 8 nH
Cooling Pin-Fin direct water cooled
Substrate material High reliable AlSiC substrate
Substrate size 152 x 92 mm
Reliability Standard AQG324
SP1000R1200D1R400D2SiC
SiC MODULE | DrivePACK 1200V/800A
Voltage/Current 1200V/1000A
Max junction temp. 175°C
Stray inductance 8 nH
Cooling Pin-Fin direct water cooled
Substrate material Cu Baseplate & Si3N4 Substrate
Substrate size 152 x 92 mm
Reliability Standard AQG324
Power Terminals Compatible with Mainstream Products
Direct Water-Cooled Design with PinFin
Highly Reliable Ceramics and Substrate Material
Complies with Automotive Reliability Standards
Optimized loop inductance design
Improved electrical module performance